GOB stands for Glue On The Board, a novel optically conductive nano-filling material. Through a special process, it transforms conventional LED display PCB boards and their surface-mounted LEDs with a dual matte finish to achieve a frosted effect on the surface of the LED display. This innovation improves the existing protection technology of LED displays and creatively realizes the conversion and display from point light sources to surface light sources, opening up broad market prospects in various fields.
GOB Process Solves Industry Pain Points
Traditional screens are fully exposed to the light source, presenting significant drawbacks:
1) Low protection level: not resistant to moisture, water, dust, shocks, or impacts. In humid climates, this leads to a high incidence of dead and broken lights. During transportation, lights can easily fall out or be damaged. Additionally, they are susceptible to static electricity, causing dead lights.
2) Harmful to eyes: Prolonged viewing can cause glare and fatigue, offering no protection to the eyes. Moreover, there is the "blue light hazard" effect. Due to the short wavelength and high frequency of blue LEDs, direct long-term exposure can lead to retinal damage.
Advantages of GOB Process
1) Eight protections: waterproof, moisture-proof, impact-resistant, dust-proof, corrosion-resistant, blue light filtering, salt-resistant, anti-static.
2) The matte effect also enhances color contrast, realizing the conversion display from point light sources to surface light sources, and increasing the viewing angle.
Detailed GOB Process
The GOB process truly meets the characteristic requirements of LED display products, ensuring standardized mass production quality and performance.
A complete production process is required, along with reliable automated production equipment developed in conjunction with the manufacturing process, custom A-type molds, and packaging materials that meet product characteristic requirements.
Cutting Materials
The packaging materials for GOB must be custom-developed according to the GOB process plan and meet the following characteristics: strong adhesion; powerful tensile strength and vertical impact resistance; hardness; high transparency; temperature resistance; resistance to yellowing; salt spray resistance; high wear resistance; anti-static; high pressure resistance, etc.
Filling
The GOB encapsulation process should ensure that the encapsulating material completely fills the space between the LEDs and covers their surfaces, firmly adhering to the PCB. There should be no air bubbles, pinholes, white spots, gaps, or insufficient filling at the bottom.
Consistency in Thickness
The uniformity of the glue layer thickness (specifically, the consistency of the glue layer thickness on the surface of the LEDs). After GOB encapsulation, it is necessary to ensure the uniformity of the glue layer thickness on the LED surface. Currently, the GOB process has been fully upgraded to version 4.0, virtually eliminating tolerance in glue layer thickness, maintaining the same tolerance as the original module's thickness before and after completion. It can even reduce the original module's thickness tolerance. The joint flatness is perfect!
Leveling
The surface flatness after GOB encapsulation should be excellent, without any bumps or waves.
Surface Treatment
The surface treatment of the GOB container. Currently, industry surface treatments vary according to product characteristics into matte, semi-matte, and mirror finishes.
Maintenance Switch
The reparability of the encapsulated GOB should ensure that the encapsulating material can be easily removed under certain conditions, and the removed part can be filled and repaired after normal maintenance.
GOB Process Supports Various LED Displays:
Suitable for small-pitch LED displays, ultra-protective rental LED displays, ultra-protective floor-standing interactive LED displays, ultra-protective transparent LED displays, LED smart panel displays, LED smart billboard displays, LED creative displays, etc.
